[KOA] LTCC Multi Layer Wiring Substrate / LTCC Package Substrate

Asia wide Manufacturing Business Platform in Philippines

TECH DIRECTORY Philippines

[KOA] LTCC Multi Layer Wiring Substrate / LTCC Package Substrate

[KOA] LTCC Multi Layer Wiring Substrate / LTCC Package Substrate

LTCC Packaging Substrate with Customised Shape, Size and Number of Layers

KOA's Low temperature Co-fired Ceramic(LTCC) Substrate is processed by our original high precision multi-layer technology and processing technology to achieve multiple cavities and flexible, complex shapes in high dimension precision.
Offers the best package design depending on the module placement and the shape of the elements to be mounted. The product also contributes to the downsizing of the modules both by micro wiring using Ag of small resistance ratio and multilayer construction.
We respond to your requirements like latter process including chip mounting by internal mounting line, wirebonding and resin molding and ball mounting.

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URL

http://www.koaglobal.com/product/ltcc?sc_lang=en

Target industry

Electrical/Electronic Parts 

Company information

KOA DENKO (S) PTE LTD KOA DENKO (S) PTE LTD

Catalogue

LTCC Multi Layer Wiring Substrate

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Category

Pick-up

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