Removal of residues, surface reforming, and ashing of φ4 to 6 inch wafers is possible by using this new plasma cleaner.
The automatic conveying mechanism contributes to prevention of wafer cracking and reduction of personnel expenses and operation time due to wafer transfer.
In addition, the process chamber achieves high throughput by simultaneous processing of two wafers.
■Distribution：± 5% or less in a wafer
■Ultra-thin piezoelectric wafers such as SAW device
■Ar plasma cleaning (option)
※Please see the document for details. Please do not hesitate to contact us.
Estimated delivery time
Stock in the Philippines
Electrical/Electronic Parts Semiconductors/LCD/FPD Automotive Parts
◎Processing method：Batch equipment with automatic conveyance
◎Vacuum pump ：Dry pump
◎Chamber size(mm) :Processing room：φ440×H195
１．Resist removal of various wafers electronic components
２．Surface modification before post-process plating
３．Remove organic contamination
４．Surface modification of resin material
５．Ultra-thin piezoelectric wafers such as SAW device
* is mandatory item